| Equipment |
- Cleanroom composed of three different areas: an ISO 14644 Class 5 (U.S Fed-Std 209D Class 100) yellow area (15 m2); an ISO 14644 Class 6 (U.S Fed-Std 209D Class 1000) area (45 m2); a not classified grey area, but approximately an ISO 14644 Class 7 (U.S Fed-Std 209D Class 10000) area (90 m2).
- Double side Mask Aligner
- Laser Direct Writer
- Reactive Ion Etcher (RIE)
- Chemical Bench for Lithographic processes
- Plasma Etcher
- Chemical Benches for Wet Etching
- E-Gun Evaporator
- Rapid Thermal Annealer (RTA)
- Plasma Enhanced Chemical Vapor Deposition (PECVD)
- Low Pressure Chemical Vapor Deposition (LPCVD)
- Oxidation furnace
- Graphene deposition furnace
- Electroplating
- Anodic Bonding
- Micro Powder Blasting
- Hot Embossing
- Micro Injection Moulding
- Microfluidic characterization setup
- CNC Milling
- Optical Microscope
- Profilometer
- Micro Electro-Discharge Machining
- 3D InkJet Printer
- Microstereolithography
- Fused Deposition Modeling
- Polymeric powder 3D printing by Direct Laser Sintering
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